Ceramic substrate for thin-film electronic components,...

Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...

Reexamination Certificate

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C428S142000, C428S210000, C428S307700, C428S410000, C428S428000, C428S446000, C428S901000, C361S306300, C361S321200, C361S762000, C361S763000, C430S313000

Reexamination Certificate

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10951731

ABSTRACT:
A first ceramic substrate includes a substrate (2) and a glaze layer (3), wherein the glaze layer has a surface having an Ra of 0.02 μm or less and a Ry of 0.25 μm or less. A second ceramic substrate is formed by subjecting a glass layer (24) formed on a surface of a substrate (2) to heating-and-pressurizing treatment, thereby forming a glaze layer (3) on the substrate (2), and planarization-polishing the surface of the glaze layer. A third ceramic substrate includes a substrate (2), a glaze layer (3) containing substantially no pores formed on the substrate (2) and the surface thereof being planarization-polished, and a wiring pattern (21), wherein at least one first end of the wiring pattern is exposed to the glaze layer (3) surface of the substrate (1), and at least one second end is exposed to another surface of the substrate (1).

REFERENCES:
patent: 4396682 (1983-08-01), Mohri et al.
patent: 4634634 (1987-01-01), Kondo et al.
patent: 4767672 (1988-08-01), Fujinaka et al.
patent: 4806334 (1989-02-01), Fujinaka et al.
patent: 6320738 (2001-11-01), Yamana et al.
patent: 2001-044073 (2001-02-01), None
patent: 2003-017301 (2003-01-01), None

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