Stock material or miscellaneous articles – Circular sheet or circular blank
Reexamination Certificate
2006-03-14
2006-03-14
Thomas, Alexander S. (Department: 1772)
Stock material or miscellaneous articles
Circular sheet or circular blank
C219S649000
Reexamination Certificate
active
07011874
ABSTRACT:
The object of the present invention is to provide a ceramic substrate that can provide a substantially uniform temperature distribution to a surface of the ceramic substrate where a semiconductor wafer is treated. A ceramic substrate for a semiconductor-producing/examining device according to the present invention is a ceramic substrate having a conductor formed on a surface of the ceramic substrate or inside the ceramic substrate, wherein said substrate is containing oxygen and having a disc form, the diameter thereof exceeding 250 mm and a thickness thereof being 25 mm or less.
REFERENCES:
patent: 3067310 (1962-12-01), Walz et al.
patent: 4034207 (1977-07-01), Tamada et al.
patent: 4443691 (1984-04-01), Sauer
patent: 4555358 (1985-11-01), Matsushita et al.
patent: 5001087 (1991-03-01), Kubota et al.
patent: 5068517 (1991-11-01), Tsuyuki et al.
patent: 5072236 (1991-12-01), Tatsumi et al.
patent: 5082163 (1992-01-01), Kanahara et al.
patent: 5310453 (1994-05-01), Fukasawa et al.
patent: 5408574 (1995-04-01), Deevi et al.
patent: 5456757 (1995-10-01), Aruga et al.
patent: 5473137 (1995-12-01), Queriaud et al.
patent: 5492730 (1996-02-01), Balaba et al.
patent: 5563764 (1996-10-01), Arakawa et al.
patent: 5582215 (1996-12-01), Yamamoto et al.
patent: 5656093 (1997-08-01), Burkhart et al.
patent: 5756215 (1998-05-01), Sawamura et al.
patent: 5843589 (1998-12-01), Hoshiya et al.
patent: 5880439 (1999-03-01), Deevi et al.
patent: 5908799 (1999-06-01), Kobayashi et al.
patent: 5965193 (1999-10-01), Ning et al.
patent: 5998321 (1999-12-01), Katsuda et al.
patent: 6025579 (2000-02-01), Tanaka et al.
patent: 6080970 (2000-06-01), Yoshida et al.
patent: 6086990 (2000-07-01), Sumino et al.
patent: 6107638 (2000-08-01), Sumino et al.
patent: 6133557 (2000-10-01), Kawanabe et al.
patent: 6176140 (2001-01-01), Autenrieth et al.
patent: 6182340 (2001-02-01), Bishop
patent: 6183875 (2001-02-01), Ning et al.
patent: 6272002 (2001-08-01), Mogi et al.
patent: 6448538 (2002-09-01), Miyata
patent: 6465763 (2002-10-01), Ito et al.
patent: 6475606 (2002-11-01), Niwa
patent: 6507006 (2003-01-01), Hiramatsu et al.
patent: 2002/0010073 (2002-01-01), Beall et al.
patent: 2003/0015521 (2003-01-01), Ito
patent: 0 393 524 (1990-10-01), None
patent: 1 109 423 (2001-06-01), None
patent: 62-167396 (1987-10-01), None
patent: 2-275770 (1990-11-01), None
patent: 2-292058 (1990-12-01), None
patent: 3-222761 (1991-10-01), None
patent: 3-255625 (1991-11-01), None
patent: 5-8140 (1993-01-01), None
patent: 6-48837 (1994-02-01), None
patent: 6-52974 (1994-02-01), None
patent: 7-11446 (1995-01-01), None
patent: 7-94576 (1995-04-01), None
patent: 7-326655 (1995-12-01), None
patent: 8-19982 (1996-01-01), None
patent: 8-133840 (1996-05-01), None
patent: 2513995 (1996-07-01), None
patent: 8-273814 (1996-10-01), None
patent: 9-165264 (1997-06-01), None
patent: 9-180867 (1997-07-01), None
patent: 9-283607 (1997-10-01), None
patent: 9-283608 (1997-10-01), None
patent: 2798570 (1998-09-01), None
patent: 10-270540 (1998-10-01), None
patent: 10-275524 (1998-10-01), None
patent: 10-279359 (1998-10-01), None
patent: 10-308348 (1998-11-01), None
patent: 11-40330 (1999-02-01), None
patent: 11-67886 (1999-03-01), None
patent: 11-74064 (1999-03-01), None
patent: 11-100270 (1999-04-01), None
patent: 11-168134 (1999-06-01), None
patent: 11-312570 (1999-11-01), None
patent: 11-339939 (1999-12-01), None
patent: 2000-12194 (2000-01-01), None
patent: 2000-143349 (2000-05-01), None
U.S. Appl. No. 09/926,296, filed Dec. 27, 2001, Ito et al.
U.S. Appl. No. 10/732,296, filed Dec. 11,2003, Ito et al.
U.S. Appl. No. 10/746,081, filed Dec. 29, 2003, Hiramatsu et al.
U.S. Appl. No. 10/755,308, filed Jan. 13. 2004, Hiramatsu et al.
U.S. Appl. No. 10/766,027, filed Jan. 29, 2004, Ito et al.
U.S. Appl. No. 09/926,296, filed Dec. 27, 2001, Ito et al.
U.S. Appl. No. 10/876,665, filed Jun. 28, 2004, Ito et al.
U.S. Appl. No. 10/901,109, filed Jul. 29, 2004, Hiramatsu et al.
U.S. Appl. No. 10/900,113, filed on Jul. 28, 2004, Hiramatsu et al.
U.S. Appl. No. 09/926,296, filed Dec. 27, 2001, Ito et al.
U.S. Appl. No. 10/855,324, filed May 28, 2004, Ito et al.
U.S. Appl. No. 10/928,146, filed Aug. 30, 2004, Hiramatsu et al.
U.S. Appl. No. 09/926,296, filed Dec. 27, 2001, Ito et al.
Hiramatsu Yasuji
Ito Yasutaka
Ibiden Co. Ltd.
Thomas Alexander S.
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