Stock material or miscellaneous articles – Perimeter or corner structure of sheet
Patent
1988-01-19
1989-08-01
Thomas, Alexander S.
Stock material or miscellaneous articles
Perimeter or corner structure of sheet
428192, B32B 302
Patent
active
048532711
ABSTRACT:
A ceramic substrate for use in packaging semiconductors is provided. The substrate is nearly rectangular. The end portion of at least one short side of the substrate comprises two outwardly projecting arcuate convex portions with a radius of curvature of Rs, an arcuate inwardly depressed concave portion with a radius of curvature of R.sub.B formed between said convex portions to define a nearly central part of said short side, corner portions with a radius of curvature of Rc each connecting the outside end portion of each arcuate convex portion to each long side of the substrate, and curvature connecting portions with a radius of curvature of Rt each connecting the inside end portion of each arcuate convex portion to each end portion of the arcuate concave portion. A pair of most projecting portions are located in the curvature connecting portions and spaced from each other by a distance corresponding to about one-half of the width of the ceramic substrate. The radii of curvatures of the individual portions are as follows:
REFERENCES:
patent: 4277528 (1981-07-01), Doi et al.
patent: 4456641 (1984-06-01), Ohtani
Nakamura Katsumi
Yamamoto Tadahisa
Kyocera Corporation
Thomas Alexander S.
LandOfFree
Ceramic substrate for semiconductor package does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Ceramic substrate for semiconductor package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ceramic substrate for semiconductor package will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-130689