Electric heating – Heating devices – Combined with container – enclosure – or support for material...
Reexamination Certificate
2005-11-01
2005-11-01
Paik, Sang Y. (Department: 3742)
Electric heating
Heating devices
Combined with container, enclosure, or support for material...
C219S546000
Reexamination Certificate
active
06960743
ABSTRACT:
A ceramic substrate for a semiconductor-producing/examining device, in which it is possible to promptly raise its temperature, a heating face thereof has a small temperature variation, and no semiconductor wafer and the like is damaged or distorted by thermal impact. The ceramic substrate for a semiconductor-producing/examining device has a resistance heating element formed on a surface thereof or inside thereof, wherein a projected portion for fitting a semiconductor wafer is formed along the periphery thereof and a large number of convex bodies, which make contact with the semiconductor wafer, are formed inside the projected portion.
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Hiramatsu Yasuji
Ito Yasutaka
Ibiden Co. Ltd.
Oblon & Spivak, McClelland, Maier & Neustadt P.C.
Paik Sang Y.
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