Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Composite having voids in a component
Patent
1994-11-28
1998-11-10
Lam, Cathy F.
Stock material or miscellaneous articles
Web or sheet containing structurally defined element or...
Composite having voids in a component
4283122, 4283155, 501134, 29 2501, B32B 326, C04B38548, B21F 4100
Patent
active
058341064
DESCRIPTION:
BRIEF SUMMARY
TECHNICAL FIELD
The present invention relates to a ceramic substrate and producing process thereof, and a suction carrier for wafers using a ceramic wafer-chucking substrate.
In detail, the present invention relates to a hard disc substrate and a producing process thereof, and in particular, to a hard disc substrate of a ceramic substrate made of sintered titanium oxide or aluminum oxide and a producing process thereof.
Also, the present invention relates to a thin-film chip capacitor consisting of a bottom thin-film electrode, a thin-film dielectric and a top thin-film electrode all formed on a substrate in that order, and in particular, to a thin-film chip capacitor using as the substrate a ceramic substrate made of a titanium oxide sintered body or aluminum oxide body.
Further, the present invention relates to a thin-film chip capacitor consisting of a bottom thin-film electrode, a thin-film dielectric and a top thin-film electrode all formed on a substrate in that order, wherein a titanium oxide substrate serves as both the substrate itself and the bottom thin-film electrode, alternatively, the titanium oxide substrate further serves as the thin-film dielectric.
Still further, the present invention relates to a ceramic substrate for hybrid ICs and a producing process thereof, and in particular to a ceramic substrate for hybrid ICs for forming a thin-film hybrid integrated circuit and a producing process thereof.
Furthermore, the present invention relates to a substrate chucking device comprising a wafer-chucking substrate for chucking and transporting or suction chucking and fixing a wafer, and in particular, to a substrate chucking device in association with a wafer hand and a wafer holder for suction chucking and transporting or fixing a wafer such as a semiconductor wafer etc.
BACKGROUND ART
Conventionally, Winchester discs have been known as a representative of magnetic disc memory devices (hard disc drives) which uses a non-magnetic metal disc for a recording magnetic disc.
The Winchester disc is a disc memory characterized in that a magnetic hard disc for recording is mounted in an unremovable or hermetically sealed disc pack together with a flying inductive head disposed above the disc surface without physical contact.
The above recording magnetic disc uses a flat substrate (a hard disc substrate) with a magnetic material layer coated thereon for recording information.
As the hard disc substrates of this kind, metallic substrates made from aluminum, an aluminum alloy or the like have been used conventionally.
Recently, development of hard discs of this kind for high-capacity has been actively being pursued, and in order to increase the recording capacity of hard discs, it is necessary to reduce a flying height of the aforementioned head from the disc surface.
To reduce the flying height of the head, flatness of the disc substrate needs to be reduced, but the improvement in flatness of the conventionally used metallic substrates of aluminum, an aluminum alloy or the like almost has come to a limit; therefore, it is difficult to fabricate flatter substrates using these materials.
As regards flatness, since ceramic substrates can be more easily fabricated than the metallic substrates, hard disc substrates made of ceramics have been desired.
It is true that ceramic substrates can be fabricated to have improved flatness, but the ceramic substrates suffer from the occurrence of many pores of 3 .mu.m or more in diameter on the surface thereof. Hence, it has been a problem that no ceramic substrate can be obtained without pores present on its surface.
It is therefore the first object of the present invention to provide a hard disc substrate made of ceramic in which large pores having diameters of 3 .mu.m or more, extremely rarely exist and to provide a producing process thereof, so as to provide a hard disc substrate which enables hard discs to have increased capacity.
And, in various types of chip capacitors at present, multi-layer ceramic capacitors are predominantly used. The capacitor of this ty
REFERENCES:
patent: 4673660 (1987-06-01), Thanh
patent: 4894273 (1990-01-01), Lieberman et al.
patent: 5518969 (1996-05-01), Ragan
patent: 5532031 (1996-07-01), Farooq et al.
patent: 5585173 (1996-12-01), Kamo et al.
Kamiaka Hideto
Kishi Yukio
Lam Cathy F.
Nihon Cement Co. Ltd.
LandOfFree
Ceramic substrate and producing process thereof, and a suction c does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Ceramic substrate and producing process thereof, and a suction c, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ceramic substrate and producing process thereof, and a suction c will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1514758