Electric heating – Heating devices – Combined with container – enclosure – or support for material...
Reexamination Certificate
2005-04-12
2005-04-12
Paik, S. (Department: 3742)
Electric heating
Heating devices
Combined with container, enclosure, or support for material...
C219S544000
Reexamination Certificate
active
06878907
ABSTRACT:
It is a an object of the present invention to provide a ceramic substrate for a semiconductor producing/examining device which has high fracture toughness value, exellent thermal shock resistivity, high thermal conductivity and an excellent temperature rising and falling properties, and is preferable as a hot plate, an electrostatic chuck, a wafer prober and the like. A ceramic substrate, for a semiconductor producing/examining device, having a conductor formed inside thereof or on the surface thereof of the present invention is the ceramic substrate, wherein said ceramic substrate has been sintered such that a fractured section thereof exhibits intergranular fracture.
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Hiramatsu Yasuji
Ito Yasutaka
Ibiden Co. Ltd.
Oblon & Spivak, McClelland, Maier & Neustadt P.C.
Paik S.
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