Ceramic substrate and method of breaking same

Details Ceramic substrate and method of breaking same Ceramic substrate and method of breaking same

2005-12-30

2009-08-18

Pham, Thanhha (Department: 2894)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S114000, C438S462000, C257SE23009

Reexamination Certificate

active

07575954

ABSTRACT:
A ceramic substrate (100) includes a top surface, a plurality of identification marks (104), a protective compound (110), a bottom surface, and a plurality of grooves (106). The top surface includes a first area and a second area. The first area is defined at one or more edges portions of the top surface. The second area is defined inside the first area. The identification marks are arranged on the first area. The protective compound is covered on the second area. The grooves are defined at the bottom surface, and corresponding to the identification marks. A related method for breaking a ceramic substrate includes: (a) pasting one or more tapes on the first area; (b) covering protective compound on the second area; (c) removing the tapes; (d) cutting the protective compound according to the identification marks; and (e) breaking the ceramic substrate into individual circuit unit pieces along the grooves.

REFERENCES:
patent: 6420244 (2002-07-01), Lee
patent: 2004/0266051 (2004-12-01), Kojima et al.

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