Ceramic substrate

Details Ceramic substrate Ceramic substrate

1993-03-29

1994-05-17

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165 803, 174252, 257714, 361748, H05K 720

Patent

active

053133617

ABSTRACT:
An improved ceramic substrate for supporting, cooling and interconnecting components on both surfaces of a substrate includes a plurality of coolant carrying channels separated by fins and extending through the substrate generally parallel to the surfaces of the substrate; and a plurality of routed vias for interconnecting component terminations on opposite surfaces of the substrate which are not aligned with each other and with a fin; each routed via includes an internal via extending through a fin and a surface blind via extending inwardly from each surface, and at least one transverse segment interconnecting one end of the internal via to one of the surface blind vias.

REFERENCES:
patent: 4631636 (1986-12-01), Andrews
patent: 4774630 (1988-09-01), Reisman et al.

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