Ceramic semiconductor package having crack arrestor patterns

Details Ceramic semiconductor package having crack arrestor patterns Ceramic semiconductor package having crack arrestor patterns

1988-07-18

1990-05-01

Davie, James W.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

174255, H01L 2314

Patent

active

049223267

ABSTRACT:
A ceramic semiconductor package wherein metal crack arrestor patterns are formed in the corners of the package thereby increasing the strength of the package and acting as a barrier to microcracks. The metal crack arrestor patterns may be electrically and physically isolated from metal interconnect lines in the package and also may be formed using the same processing steps that are used to form the metal interconnect lines.

REFERENCES:
patent: 4417392 (1983-12-01), Ibrahim et al.

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