Ceramic semiconductor package chip prevention structure and meth

Details Ceramic semiconductor package chip prevention structure and meth Ceramic semiconductor package chip prevention structure and meth

1985-03-11

1985-11-12

Dixson, Jr., William T.

Special receptacle or package

For a vehicle

206593, 206330, 174 52PE, 174 52FP, 357 72, 357 74, 357 80, 29588, B65D 8530, B65D 8100, H05F 302, H05K 500

Patent

active

045522677

ABSTRACT:
A hermetic ceramic semiconductor package is provided with impact absorbing bumpers by applying a composition of sealing glass loaded with malleable metal particles to the ceramic package. The bumpers are applied to the ceramic parts when they are being coated with sealing glass. When the hermetic package seal is formed the bumpers will form a metal loaded matrix that will absorb impacts and thereby avoid chipping of the ceramic package due to impacts during handling.

REFERENCES:
patent: 2951612 (1960-09-01), Salzenbrodt
patent: 4171049 (1979-10-01), Nohara et al.
patent: 4231901 (1980-11-01), Berbeco
patent: 4463851 (1984-08-01), Cecil
patent: 4470507 (1984-09-01), Burns

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