Ceramic ring for guiding a wafer down to the lower electrode of

Details Ceramic ring for guiding a wafer down to the lower electrode of Ceramic ring for guiding a wafer down to the lower electrode of

1996-07-26

1998-03-17

Powell, William

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

H01L 2100

Patent

active

057282544

ABSTRACT:
A structural configuration for a ceramic ring for guiding a semiconductor wafer down to the lower electrode of a dry etcher having upper and lower electrodes. The ceramic ring includes a base ring, a wall ring rising perpendicular to one surface of the base ring, and more than ten projections located on the top edge surface of the wall ring. Each of the projections includes a first and a second triangular surface, each at one end of the prismatic body and rising from the top edge surface of the wall ring. An inner sloped surface rises from-the top edge surface of the wall ring and an outer sloped surface rises from the top edge surface of the wall ring. First and second oblique sloped surfaces rise from the top edge surface of the wall ring, connecting the first and second triangular surfaces to the inner sloped surface, respectively. A trapezoidal surface having four sides, one each joined to the inner and outer sloped surfaces and the first and second oblique sloped surfaces forms an apex surface of the projection.

REFERENCES:
patent: 4816098 (1989-03-01), Davis et al.
patent: 5611865 (1997-03-01), White et al.

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