Electric heating – Heating devices – Combined with container – enclosure – or support for material...
Reexamination Certificate
2005-04-26
2005-04-26
Paik, Sang (Department: 3742)
Electric heating
Heating devices
Combined with container, enclosure, or support for material...
C118S724000
Reexamination Certificate
active
06884972
ABSTRACT:
A ceramic heater for a semiconductor producing/examining device including a ceramic substrate having a disc form with a diameter exceeding 200 mm and first and second surfaces, the first surface being a wafer-holding face and the second surface opposing to the first surface, the wafer-holding face being such that a semiconductor wafer is directly put on the wafer-holding face or held apart from the wafer-holding face by a supporting pin. The wafer-holding face has a surface roughness Rmax of 0.1 to 250 μm according to JIS R 0601, and a difference between the surface roughness of the wafer-holding face and surface roughness of the second surface is 50% or less.
REFERENCES:
patent: 5324012 (1994-06-01), Aoyama et al.
patent: 5665260 (1997-09-01), Kawada et al.
patent: 6465763 (2002-10-01), Ito et al.
patent: 6475606 (2002-11-01), Niwa
patent: 6507006 (2003-01-01), Hiramatsu et al.
patent: 6677557 (2004-01-01), Ito et al.
patent: 20020043527 (2002-04-01), Ito
patent: 20030015521 (2003-01-01), Ito
patent: 59-47822 (1984-03-01), None
patent: 61-84037 (1986-04-01), None
patent: 61-197485 (1986-09-01), None
patent: 62-224952 (1987-10-01), None
patent: 1-201826 (1989-08-01), None
patent: 4-325462 (1992-11-01), None
patent: 5-36819 (1993-02-01), None
patent: 5-235149 (1993-09-01), None
patent: 7-280462 (1995-10-01), None
patent: 7-296377 (1995-11-01), None
patent: 2587289 (1996-12-01), None
patent: 9-134951 (1997-05-01), None
patent: 10-72260 (1998-03-01), None
patent: 10-275524 (1998-10-01), None
patent: 11-40330 (1999-02-01), None
patent: 11-74064 (1999-03-01), None
patent: 2943275 (1999-06-01), None
patent: 2000-286330 (2000-10-01), None
patent: 2001-168177 (2001-06-01), None
U.S. Appl. No. 10/746,081, filed Dec. 29, 2002, Hiramatsu, et al.
U.S. Appl. No. 10/755,308, filed Jan. 13, 2004, Hiramatsu, et al.
U.S. Appl. No. 10/766,027, filed Jan. 29, 2004, Ito, et al.
U.S. Appl. No. 09/471,759, filed Dec. 23, 1999, Saito et al.
U.S. Appl. No. 09/462,067, filed Jan. 5, 2001, Furukawa et al.
U.S. Appl. No. 10/345,356, filed Jan. 16, 2003, Ito.
U.S. Appl. No. 09/787,954, filed Mar. 23, 2001, Ito.
U.S. Appl. No. 09/787,816, filed Mar. 23, 2001, Ito.
U.S. Appl. No. 09/787,818, filed Mar. 23. 2001, Ito.
U.S. Appl. No. 09/806,957, filed Apr. 6, 2001, Ito et al.
U.S. Appl. No. 09/926,730, filed Apr. 16, 2001, Hiramatsu et al.
U.S. Appl. No. 09/880,742, filed Jun. 13, 2001, Saito et al.
U.S. Appl. No. 09/880,359, filed Jun. 13, 2001, Saito et al.
U.S. Appl. No. 09/880,379, filed Jun. 13, 2001, Saito et al.
U.S. Appl. No. 09/915,418, filed Jul. 27, 2001, Ito.
U.S. Appl. No. 09/916,682, filed Jul. 30, 2001, Ito.
U.S. Appl. No. 09/890,358, filed Jul. 30, 2001, Ito.
U.S. Appl. No. 09/917,749, filed Jul. 31, 2001, Ito.
U.S. Appl. No. 09/958,689, Oct. 10, 2001, Furukawa et al.
U.S. Appl. No. 09/979,676, Nov. 5, 2001, Zhou.
U.S. Appl. No. 10/048,894, filed Feb. 1, 2002, Furukawa.
U.S. Appl. No. 10/049,539, filed Nov. 7, 2001, Zhou.
U.S. Appl. No. 10/182,099, filed Jul. 24, 2002, Zhou.
U.S. Appl. No. 10/222,928, filed Aug. 19, 2002, Ito.
U.S. Appl. No. 10/265,413, filed Oct. 7, 2002, Ohashi et al.
U.S. Appl. No. 10/356,519, filed Feb. 3, 2003, Ito.
U.S. Appl. No. 10/217,029, filed Aug. 13, 2002, Ito.
U.S. Appl. No. 09/806,477, filed Jun. 25, 2001, Ito et al.
U.S. Appl. No. 09/831,887, filed May 23, 2001, Ito et al.
U.S. Appl. No. 09/807,960, filed May 18, 2001, Hiramatsu et al.
U.S. Appl. No. 09/806,478, filed Jul. 26, 2001, Ito et al.
U.S. Appl. No. 6,507,006, filed Jan. 14, 2003, Hiramatsu et al.
U.S. Appl. No. 09/869,321, filed Oct. 18, 2001, Zhou.
U.S. Appl. No. 6,465,763, filed Oct. 15, 2002, Ito et al.
U.S. Appl. No. 09/026,012, filed Oct. 24, 2001, Hiramatsu et al.
U.S. Appl. No. 09/926,092, filed Dec. 27, 2001, Ito et al.
U.S. Appl. No. 09/926,297, filed Dec. 26, 2001, Hiramatsu et al.
U.S. Appl. No. 09/926,296, filed Dec. 27, 2001, Ito et al.
U.S. Appl. No. 09/926,362, filed Jan. 16, 2002, Hiramatsu et al.
U.S. Appl. No. 09/926,465, filed Feb. 12, 2002, Furukawa et al.
U.S. Appl. No. 09/926,464, filed Jan. 10, 2002, Hiramatsu et al.
U.S. Appl. No. 09/926,499, filed Mar. 26, 2002, Hiramatsu et al.
U.S. Appl. No. 09/926,714, filed Mar. 5, 2002, Ito et al.
U.S. Appl. No. 09/926,713, filed Mar. 5, 2002, Hiramatsu.
U.S. Appl. No. 10/009,174, filed Apr. 21, 2003, Hiramatsu et al.
U.S. Appl. No. 10/019,448, filed Apr. 8, 2002, Ito et al.
U.S. Appl. No. 09/926,800, filed Mar. 19, 2002, Hiramatsu et al.
U.S. Appl. No. 10/019,444, filed Apr. 23, 2002, Hiramatsu et al.
U.S. Appl. No. 6,677,557, filed Jan. 13, 2003, Ito et al.
U.S. Appl. No. 10/019,311, filed Apr. 9, 2002, Hiramatsu et al.
U.S. Appl. No. 10/030,123, filed May 16, 2002, Hiramatsu et al.
U.S. Appl. No. 10/049,293, filed Apr. 30, 2002, Ito et al.
U.S. Appl. No. 10/060,943, filed Jul. 10, 2002, Ito et al.
U.S. Appl. No. 10/048,490, filed Apr. 30, 2002, Ito et al.
U.S. Appl. No. 10/048,979, filed Apr. 26, 2002 Hiramatsu et al.
U.S. Appl. No. 10/069,511, filed Jun 24, 2002, Ito et al.
U.S. Appl. No. 10/069,510, filed Jun. 20, 2002, Hiramatsu et al.
U.S. Appl. No. 10/070,443, filed Jun. 24, 2002, Hiramatsu et al.
U.S. Appl. No. 10/070,441, filed Jun. 26, 2002, Ito et al.
U.S. Appl. No. 10/088,098, filed May 30, 2002, Ito et al.
U.S. Appl. No. 10/088,100, filed Jun. 26, 2002, Ido.
U.S. Appl. No. 10/118,967, filed Apr. 10, 2002, Ito et al.
U.S. Appl. No. 10/111,980, filed Jun. 27, 2002, Ito et al.
U.S. Appl. No. 10/168,527, filed Oct. 18, 2002, Hiramatsu et al.
U.S. Appl. No. 10/181,724, filed Sep. 27, 2002, Hiramatsu et al.
U.S. Appl. No. 10/226,160, filed Aug. 23, 2002, Ito et al.
U.S. Appl. No. 10/229,177, filed Aug. 28, 2002, Hiramatsu et al.
U.S. Appl. No. 10/277,818, filed Oct. 23, 2002, Hiramatsu et al.
U.S. Appl. No. 10/311,368, filed May 9, 2002, Ito et al.
U.S. Appl. No. 10/352,138, filed Jan. 28, 2003, Hiramatsu et al.
U.S. Appl. No. 10/346,095, filed Jan. 17, 2003, Ito et al.
U.S. Appl. No. 10/343,747, filed Aug. 27, 2003, Ito et al.
U.S. Appl. No. 10/344,148, filed Jul. 29, 2003, Kariya et al.
U.S. Appl. No. 10/343,833, filed Sep. 22, 2003, Zhou et al.
U.S. Appl. No. 10/386,615, filed Mar. 13, 2003, Hiramatsu et al.
U.S. Appl. No. 10/387,452, filed Mar. 14, 2003, Ito et al.
U.S. Appl. No. 10/363,310, filed Mar. 3, 2003, Ito.
U.S. Appl. No. 10/397,321, filed Mar. 27, 2003, Hiramatsu et al.
U.S. Appl. No. 10/398,393, filed Jan. 21, 2004, Hiramatsu et al.
U.S. Appl. No. 10/442,967, filed May 22, 2003, Hiramatsu et al.
U.S. Appl. No. 6,475,606, filed Nov. 5, 2002, Niwa.
U.S. Appl. No. 10/260,360, filed Oct. 1, 2002, Niwa.
U.S. Appl. No. 10/615,950, filed Jul. 10,2003, Hiramatsu et al.
U.S. Appl. No. 10/416,497, filed Dec. 11, 2003, Hiramatsu et al.
U.S. Appl. No. 10/618,651, filed Jul. 15, 2003, Ito et al.
U.S. Appl. No. 10/618,623, filed Jul. 15, 2003, Ito et al.
U.S. Appl. No. 10/618,655, filed Jul. 15, 2003, Ito et al.
U.S. Appl. No. 10/618,665, filed Jul. 15, 2003, Ito et al.
U.S. Appl. No. 10/432,639, filed Nov. 6, 2003, Ito et al.
U.S. Appl. No. 10/619,567, filed Jul. 16, 2003, Hiramatsu et al.
U.S. Appl. No. 10/362,941, filed Apr. 28, 2003, Ito.
U.S. Appl. No. 09/524,010, filed Mar. 13, 2000, Niwa.
U.S. Appl. No. 09/946,463, filed Sep. 6, 2001, Niwa.
U.S. Appl. No. 10/244,008, filed Sep. 16, 2002, Niwa.
U.S. Appl. No. 10/670,354, filed Sep. 26, 2003, Niwa.
U.S. Appl. No. 10/658,454, filed Sep. 10, 2003, Ito et al.
U.S. Appl. No. 10/663,681, filed Sep. 17, 2003, Ito et al.
U.S. Appl. No. 10/473,585, filed Feb. 13, 2004, Ito et al.
U.S. Appl. No. 10/697,287, filed Oct. 31, 2003, Ito et al.
U.S. Appl. No. 10/718,535, filed Nov. 24, 2003, Hiramatsu et al.
U.S. Appl. No. 09/673,953, filed Dec. 21, 2000, Ito et al.
U.S. Appl. No. 10/732,296, filed Dec. 11, 2003, Ito et al.
U.S. Appl. No. 10/759,083, filed Jan. 20, 2004, Hiramatsu, et al.
Material Processing Data File No. 1295 With partial English translation.
Material Processing Data File No. 3573 With partial English translation.
Material Processing Data File No. 3564 With partial English translation.
Reference Material 1 With partial English translation.
Reference Material 2 With
Hiramatsu Yasuji
Ito Yasutaka
Ibiden Co. Ltd.
Oblon & Spivak, McClelland, Maier & Neustadt P.C.
Paik Sang
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