Ceramic packages and ceramic wiring board

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type

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361714, 257678, 257712, H01L 2302

Patent

active

052947505

ABSTRACT:
A ceramic package for containing a semiconductor chip including a heat radiating plate, a base plate for wiring, and a ceramic package for containing a semiconductor chip. The package contains a ceramic board, a ceramic cap and a metal lead frame. The heat radiating plate and the ceramic board are made of silicon nitride sintered body, which is characterized in that the number of grain boundaries per a 10 .mu.m straight line drawn in an arbitrary section of the sintered (polycrystal) body is 20 or fewer.

REFERENCES:
patent: 4780572 (1988-10-01), Kondo et al.
patent: 4801488 (1989-01-01), Smith
patent: 4818821 (1989-04-01), Wentworth et al.
patent: 4827082 (1989-05-01), Horiuchi et al.
patent: 4831212 (1989-05-01), Ogata et al.
patent: 4925024 (1990-05-01), Ellenberger et al.
patent: 4931854 (1990-06-01), Yonemasu et al.
patent: 4992628 (1991-02-01), Beppu et al.
Journal of the American Ceraic Society, vol. 56, No. 10, Oct. 1973, Columbus, US pp. 518-522; Lange: "Relation Between Strength, Fracture Energy and Microstructure of Hot-Pressed Si3N4".
Patent Abstracts of Japan, vol. 14, No. 412 (C-0755) Sep. 6, 1990 & JP-A-2157160 (Kyocera Corp) Jun. 15, 1990.

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