Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent
1991-09-16
1994-03-15
Picard, Leo P.
Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
361714, 257678, 257712, H01L 2302
Patent
active
052947505
ABSTRACT:
A ceramic package for containing a semiconductor chip including a heat radiating plate, a base plate for wiring, and a ceramic package for containing a semiconductor chip. The package contains a ceramic board, a ceramic cap and a metal lead frame. The heat radiating plate and the ceramic board are made of silicon nitride sintered body, which is characterized in that the number of grain boundaries per a 10 .mu.m straight line drawn in an arbitrary section of the sintered (polycrystal) body is 20 or fewer.
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Journal of the American Ceraic Society, vol. 56, No. 10, Oct. 1973, Columbus, US pp. 518-522; Lange: "Relation Between Strength, Fracture Energy and Microstructure of Hot-Pressed Si3N4".
Patent Abstracts of Japan, vol. 14, No. 412 (C-0755) Sep. 6, 1990 & JP-A-2157160 (Kyocera Corp) Jun. 15, 1990.
Isomura Manabu
Sakai Hiroaki
Soma Takao
Yano Shinsuke
Ledynh Bot L.
NGK Insulators Ltd.
Picard Leo P.
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