Ceramic packaged semiconductor device

Details Ceramic packaged semiconductor device Ceramic packaged semiconductor device

1985-07-03

1987-03-17

James, Andrew J.

357 81, 357 67, 357 80, H01L 2336, H01L 2314, H01L 2302

Patent

active

046511920

ABSTRACT:
A semiconductor device with a semiconductor element encased in a hollow ceramic package. The portion of the package at which the semiconductor element is disposed is formed from SiC admixed with Be or a compound of Be.

REFERENCES:
patent: 4142203 (1979-02-01), Dietz
patent: 4172109 (1979-10-01), Smoak
patent: 4352120 (1982-09-01), Kurihara et al.
patent: 4370421 (1983-01-01), Matsushita et al.
patent: 4517584 (1985-05-01), Matsushita et al.

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