Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough
Reexamination Certificate
2005-05-03
2005-05-03
Lam, Cathy F. (Department: 1775)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Entirely of metal except for feedthrough
C257S704000, C257S729000, C257S730000
Reexamination Certificate
active
06888239
ABSTRACT:
The invention provides a ceramic package, a ceramic package having such a sealing structure and a fabrication method of thereof. In the ceramic package, a wall layer made of a plurality of laminated ceramic sheets and having a cavity formed in a central portion thereof is stacked on a top of a base layer made of a plurality of laminated ceramic sheets. A metal layer is coated on the wall layer around the cavity to expose an outer peripheral portion of the wall layer. A glass layer is coated on the outer peripheral portion of the wall layer, which is not coated with the metal layer, to contact with the metal layer. A lid is attached on the metal layer to seal the cavity. The glass layer is coated around the metal layer, which is attached on the ceramic wall layer around the cavity, to reinforce the bonding force between the metal layer and the underlying ceramic wall layer thereby potentially preventing creation of cracks between the metal layer and the underlying ceramic wall layer.
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Lam Cathy F.
Lowe Hauptman & Berner LLP
Samsung Electro-Mechanics Co. Ltd.
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