Ceramic package main body

Details Ceramic package main body Ceramic package main body

1994-11-23

1997-04-15

Ledynh, Bot L.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

257692, 257700, H01L 2302

Patent

active

056211902

ABSTRACT:
In a ceramic package main body having a circuit wiring provided to a ceramic substrate and including first and second independent circuit wires, first and second conductive layers are formed on the ceramic substrate. A first connection wire is provided to connect between the first circuit wire and the first conductive layer. A second connection wire is provided to connect between the second circuit wire and the second conductive layer. The first and second conductive layers are electrically insulated from each other for enabling to examine an electrical connection between the first and second conductive layers and determine, from the result of the examination, whether a short circuit is developed between the first and second circuit wires.

REFERENCES:
patent: 4320438 (1982-03-01), Ibrahim et al.
patent: 4705917 (1987-11-01), Gates, Jr. et al.
patent: 4866841 (1989-09-01), Hubbard
patent: 4970577 (1990-11-01), Ogihara et al.
patent: 4972253 (1990-11-01), Palino et al.
patent: 5258648 (1993-11-01), Lin
patent: 5285352 (1994-02-01), Pastore et al.
patent: 5376588 (1994-12-01), Pendse
patent: 5400210 (1995-03-01), Sugimoto et al.

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