Ceramic package lid having metallized layer with varying widths

Details Ceramic package lid having metallized layer with varying widths Ceramic package lid having metallized layer with varying widths

1996-10-10

1998-07-14

Shoap, Allan N.

Receptacles

Closures

174 505, 174 5051, 2281246, 220359, B65D 5300

Patent

active

057790817

ABSTRACT:
In a ceramic lid for a semiconductor package, a metallized layer is generally uniform in width and has at least one increased or reduced width portion or a plurality of increased or reduced width portions which are arranged in intervals.

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Walter M. C. Yang, "Preflow Solder Ceramic Lids for Hermetic Packages", Solid State Technology, vol. 27, No. 12, Dec. 1984, pp. 137-143.

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