Ceramic package for semiconductor devices

Details Ceramic package for semiconductor devices Ceramic package for semiconductor devices

1986-05-12

1987-06-23

Swisher, Nancy A.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428472, 428699, 428901, 428660, 428665, 428672, B32B 1504, C23F 700

Patent

active

046752439

ABSTRACT:
A ceramic package for semiconductor devices comprises a ceramic base, a gold-plated die-bonding area formed on the base for mounting thereon a semiconductor die, a gold-plated wire-bonding area, and a plurality of outerlead portions for electrically connecting the package to external printed circuits or the like. Cobalt or cobalt alloy, instead of nickel, is plated on the die-bonding and wire-bonding areas as underlayers of the gold-plated layers. Cobalt can also be plated on the outerlead portions, which may or may not have gold plated thereon.

REFERENCES:
patent: 3079676 (1963-03-01), Myers
patent: 3350180 (1967-10-01), Croll
patent: 3460968 (1969-08-01), Bate et al.
patent: 3537892 (1970-11-01), Milkovich et al.
patent: 4050956 (1977-09-01), de Bruin et al.
patent: 4065588 (1977-12-01), Arnold
patent: 4153753 (1979-05-01), Woodman et al.
patent: 4282043 (1981-08-01), Chang
patent: 4465742 (1984-08-01), Nagashima et al.

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