Ceramic package for high frequency semiconductor devices

Details Ceramic package for high frequency semiconductor devices Ceramic package for high frequency semiconductor devices

1988-06-07

1989-06-13

Sikes, William L.

357 75, 357 80, H01L 2302, H01L 2316, H01L 3902

Patent

active

048397172

ABSTRACT:
A ceramic semiconductor package suitable for high frequency operation includes internal and external ground planes formed on opposite faces of a ceramic base member. The internal ground plane is connected to a ground ring formed on the packaged semiconductor device, and both ground planes are interconnected about the periphery of the package. In this way, a uniform and continuous ground is provided to minimize variations in signal transmission line impedance.

REFERENCES:
patent: 3683241 (1972-08-01), Duncan
patent: 4288841 (1981-09-01), Gogal
patent: 4513355 (1985-04-01), Schroeder et al.
patent: 4551746 (1985-11-01), Gilbert et al.
patent: 4561006 (1985-12-01), Currie
patent: 4608592 (1986-08-01), Miyamoto
patent: 4630172 (1986-12-01), Stenerson et al.
"The Impact of Inductance On Semiconductor Packaging" by Schaper, L. W., Published: Proc. First Annual Conf. Int'l. Elect. Packaging Soc., Cleveland, Ohio, Nov. 9-10, 1981.

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