Ceramic package component having one quarter wavelength spaced c

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357 80, H01L 2314

Patent

active

051423529

ABSTRACT:
A ceramic package component has a base portion and an upstanding enclosing wall on the base portion, the upper surface of the wall being provided with an electrically conductive coating in order to receive a lid sealingly thereon. The electrically conductive coating on the upper surface of the wall is electrically connected to a further conductive coating on the undersurface of the base portion by means of a high density array of conductive vias extending through the wall. The inter via spacing between adjacent vias is preferably less than one quarter of the wavelength of the frequency at which the component is to operate.

REFERENCES:
patent: 4551747 (1985-11-01), Gilbert et al.
patent: 4879588 (1989-11-01), Ohtsuka et al.
patent: 4881116 (1989-11-01), Hidada et al.
patent: 4890155 (1989-12-01), Miyagawa et al.
patent: 4908694 (1990-03-01), Hidaka et al.
patent: 4922325 (1990-05-01), Smeltz et al.
patent: 5043794 (1991-08-01), Tai et al.

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