Ceramic package

Details Ceramic package Ceramic package

1988-06-16

1989-05-02

Grimley, Arthur T.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

357 74, H01L 2308

Patent

active

048270822

ABSTRACT:
A ceramic package includes a high thermal conductive ceramic substrate (AlN or SiC sintered substrate) on which a semiconductor element is mounted, and a mullite sintered frame having metal conductive paths therein and joined to the substrate.

REFERENCES:
patent: 4135038 (1979-01-01), Takami et al.
patent: 4460916 (1984-07-01), Hashimoto et al.
patent: 4780572 (1988-10-01), Kondo et al.
Iwase et al., "Aluminum Nitride Multi-Layer Pin Grid Array Packages", Proceedings of 37th Electronic Components Conference, May 11-13, 1987, pp. 384-391.
Osaka et al., "Metalization of AlN Ceramics by Electroless Ni-P Plating", J. Electrochem. Soc., vol. 133, No. 11, Nov. 1986, pp. 2345-2349.
Mitsuru Ura, "High Thermal Conductive Ceramic Substrate Material", Engineering Material, vol. 34, No. 4, 1986, pp. 98-106 [The Nikkan Kogyo Shinbun, Ltd.].

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