Ceramic/organic multilayer interconnection board

Details Ceramic/organic multilayer interconnection board Ceramic/organic multilayer interconnection board

1986-11-17

1988-04-26

Kittle, John E.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428428, 428432, 428901, 156 89, B32B 300, B32B 1500

Patent

active

047404140

ABSTRACT:
A multilayer board comprising a novel construction of ceramic and organic layers to reduce difficulties commonly encountered by board materials and components attached thereto having differing thermal coefficients of expansion. The multilayer board comprises an inorganic ceramic surface which is affixedly attached via a compliant adhesive to a conventional plated up post or plated thru hole organic multilayer board.

REFERENCES:
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patent: 4338380 (1982-07-01), Erickson et al.
patent: 4522667 (1985-06-01), Hanson et al.
patent: 4556598 (1985-12-01), Bloom et al.
patent: 4624896 (1986-11-01), Watanabe et al.
Computer-Generated Models Abridge Thermal Analysis of Packaged VLSI, Electronics, Feb. 10, 1982; pp. 145-148, Masood Murtuza.
Flexible Circuits Offer a Simple Solution to Chip-Carrier Mounting, Electronics, Feb. 23, 1984; pp. 149-151, Peter Kirby.
Thick-Film Multilayer Boards Resist Thermal and Mechanical Stress, Military/Space, Dec. 16, 1985; pp. 44J-44M, Han Danielsson.

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