Ceramic multilayer wiring board

Details Ceramic multilayer wiring board Ceramic multilayer wiring board

1984-08-14

1986-08-05

Kucia, R. R.

Electricity: conductors and insulators

Conduits, cables or conductors

Single duct conduits

361414, H05K 102

Patent

active

046044965

ABSTRACT:
A ceramic multilayer wiring board is provided in which ceramic insulating layers and wiring patterns provided thereon are connected by conductors filling through-holes formed in the ceramic insulating layers. The through-holes are so formed that the superficial portions of each through-hole of the ceramic multilayer wiring board is smaller in diameter than the inside portion of the through-hole between the superficial portion. This can prevent the board from being cracked around the through-holes.

REFERENCES:
patent: 3250848 (1966-05-01), Beelitz et al.
patent: 3561110 (1971-02-01), Feulner et al.
patent: 4211603 (1980-07-01), Reed
patent: 4237606 (1980-12-01), Niwa et al.
patent: 4336551 (1982-06-01), Fujita et al.
patent: 4368503 (1983-01-01), Kurosawa et al.

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