Ceramic multilayer circuit board and semiconductor module

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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Details

29846, 29849, 174255, 174256, 174257, 174238, 361792, 361793, 361794, 428901, H05K 103, H05K 109, H05K 116

Patent

active

RE0348872

ABSTRACT:
A ceramic multilayer circuit board comprising ceramic layers and wiring conductor layers laminated alternately, in which the ceramic layer has a thermal expansion coefficient lower than that of the wiring conductor and not lower than one half of that of the conductor layer and is formed from a glass which softens at a temperature not higher than the melting point of the wiring conductor layer; a semiconductor module having a high reliability in its solder joint part comprising said ceramic multilayer circuit board mounted with a ceramic carrier substrate being mounted with a semiconductor device, said board being able to use a silver or copper conductor having a good electro-conductivity; and an amorphous glass powder for said ceramic multilayer circuit board.

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IBM Technical Disclosure Bulletin "Low-Dielectric Glass Substrate" by Anderson et al. vol. 14 No. 9 Feb. 1972.

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