Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1991-04-10
1995-03-28
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
29846, 29849, 174255, 174256, 174257, 174238, 361792, 361793, 361794, 428901, H05K 103, H05K 109, H05K 116
Patent
active
RE0348872
ABSTRACT:
A ceramic multilayer circuit board comprising ceramic layers and wiring conductor layers laminated alternately, in which the ceramic layer has a thermal expansion coefficient lower than that of the wiring conductor and not lower than one half of that of the conductor layer and is formed from a glass which softens at a temperature not higher than the melting point of the wiring conductor layer; a semiconductor module having a high reliability in its solder joint part comprising said ceramic multilayer circuit board mounted with a ceramic carrier substrate being mounted with a semiconductor device, said board being able to use a silver or copper conductor having a good electro-conductivity; and an amorphous glass powder for said ceramic multilayer circuit board.
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Nagayama Kousei
Ogihara Satoru
Shinohara Hiroichi
Soga Tasao
Ushifusa Nobuyuki
Hitachi , Ltd.
Picard Leo P.
Sparks D.
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