Ceramic multilayer circuit board and semiconductor module

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

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174 685, 361414, H05K 0103

Patent

active

048211427

ABSTRACT:
A ceramic multilayer circuit board comprising ceramic layers and wiring conductor layers laminated alternately, in which the ceramic layer has a thermal expansion coefficient lower than that of the wiring conductor and not lower than one half of that of the conductor layer and is formed from a glass which softens at a temperature not higher than the melting point of the wiring conductor layer; a semiconductor module having a high reliability in its solder joint part comprising said ceramic multilayer circuit board mounted with a ceramic carrier substrate being mounted with a semiconductor device, said board being able to use a silver or copper conductor having a good electro-conductivity; and an amorphous glass powder for said ceramic multilayer circuit board.

REFERENCES:
patent: 3030215 (1962-04-01), Veatch et al.
patent: 4374391 (1983-02-01), Camliel
patent: 4547625 (1985-10-01), Tosaki et al.
patent: 4620264 (1986-10-01), Ushifusa et al.
patent: 4672152 (1987-06-01), Shinohara et al.
patent: 4685033 (1987-08-01), Inoue
Anderson et al., Low-Dielectric Glass Substrate, IBM Tech. Disc. Bull., vol. #14, #9, Feb. 1972, p. 2581.

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