Ceramic multilayer circuit board and a process for manufacturing

Details Ceramic multilayer circuit board and a process for manufacturing Ceramic multilayer circuit board and a process for manufacturing

1982-09-23

1984-08-07

Morgenstern, Norman

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427101, 427103, B05D 512

Patent

active

044644205

ABSTRACT:
A ceramic multilayer circuit board is provided by sintering a multilayer wiring substrate containing alumina as a main component, which was prepared by the green sheet process, nickel plating and gold plating in this order on the superficial wiring conductor layer, printing a thick film conductor paste on the gold plating layer, firing the printed substrate and finally printing a thick film resistor paste on at least part of the thick film conductor layer and firing to form a thick film resistor layer.

REFERENCES:
patent: 3381256 (1966-02-01), Schuller
patent: 4316920 (1982-02-01), Brown

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