Ceramic multi-layer wiring substrate and process for preparation

Stock material or miscellaneous articles – Structurally defined web or sheet – Including aperture

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Details

428209, 428426, 428433, 428457, 428901, 427 96, 361397, 361414, 156 89, B32B 300

Patent

active

050843230

ABSTRACT:
Disclosed is a ceramic multi-layer wiring board comprising a multi-layer wiring board having a plurality of insulating layers and a plurality of refractory metal layers, which are alternately formed, the end portion of the outermost insulating layer among the insulating layers being covered with the outermost refractory metal layer among the refractory metal layers, an oxidation-resistant barrier layer formed on the outermost refractory metal layer, and a thick film conductor formed on the outermost insulating layer and the oxidation-resistant barrier layer. In this structure, since the end portion of the outermost insulating layer is covered with the oxidation-resistant barrier layer, defects do not appear in the end portion and the inner conductor layers are not oxidized even in a high-temperature oxidizing atmosphere.

REFERENCES:
patent: 4493789 (1985-01-01), Veyama et al.
patent: 4604496 (1986-08-01), Ishihara et al.
patent: 4791239 (1988-12-01), Shirahata et al.
patent: 4870746 (1989-10-01), Klaser
patent: 4893404 (1990-01-01), Shirahata et al.

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