Ceramic multi-layer wiring board

Details Ceramic multi-layer wiring board Ceramic multi-layer wiring board

1994-01-21

1995-08-08

Ryan, Patrick J..

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428209, 428432, 428617, 428618, 428673, 428901, B32B 900

Patent

active

054397324

ABSTRACT:
In a ceramic multi-layer wiring board, a surface conductor layer is made of a copper-based material and an inner conductor in the ceramic multilayer is a non-copper metal having a melting point higher than a temperature at which the ceramic multilayer is fired, typically Ag. Cu and Ag form eutectic crystals when firing the surface conductor layer of Cu. This can be prevented by connecting the surface conductor layer and the inner conductor with Ag-Pd or a metal which is different from the materials of the surface wiring layer and the inner conductor and which does not form eutectic crystals with the material of the surface wiring layer at the temperature at which the surface wiring layer is fired.

REFERENCES:
patent: 4795670 (1989-01-01), Nishigaki et al.

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