Ceramic multi-layer printed circuit boards

Details Ceramic multi-layer printed circuit boards Ceramic multi-layer printed circuit boards

1989-03-30

1990-04-03

Nimmo, Morris H.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174256, H05K 100

Patent

active

049142607

ABSTRACT:
A ceramic multi-layer printed circuit board is manufactured by forming a wiring pattern layer on a ceramic substrate through copper plating and forming an insulating layer thereon and then repeating the steps for forming both layers.

REFERENCES:
patent: 4325780 (1982-04-01), Schulz, Sr.
patent: 4529835 (1985-07-01), Mizuno
patent: 4598167 (1986-07-01), Ushifusa et al.
patent: 4713494 (1987-12-01), Oikawa et al.
patent: 4795670 (1989-01-01), Nishigaki et al.
patent: 4821142 (1989-04-01), Ushifusa et al.
patent: 4828961 (1989-05-01), Lau et al.

Affiliated with

Also associated with

Rating

Ceramic multi-layer printed circuit boards does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Ceramic multi-layer printed circuit boards, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ceramic multi-layer printed circuit boards will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1358707