Ceramic lid for sealing semiconductor element and method of manu

Details Ceramic lid for sealing semiconductor element and method of manu Ceramic lid for sealing semiconductor element and method of manu

1990-03-14

1992-06-16

LaRoche, Eugene R.

357 70, 357 73, H01L 2302

Patent

active

051228629

ABSTRACT:
A ceramic lid for sealing a semiconductor element and having a sealing surface which is to seal a semiconductor element within a recess of a ceramic package, by heating the recess with glass sealant and hermetically sealing the semiconductor element. The ceramic lid is made of alumina of high purity and to the sealing surface of the ceramic lid is applied a glass sealing aid which is pretreated at a higher temperature than the heating temperature for sealing the semiconductor element, before hermetically sealing the semiconductor element in the ceramic package. A method of manufacturing a ceramic lid for sealing a semiconductor element includes the steps of manufacturing the ceramic lid with alumina of high purity having a sealing surface with the recess of the ceramic package, wherein to the sealing surface of the ceramic lid is applied a glass sealing aid of 5-30 .mu.m in thickness onto a sealing surface of the ceramic lid with the ceramic package. The ceramic lid is heat-treated at a higher temperature than the sealing temperature of the semiconductor element. Thereafter a glass sealant is applied and dried on the glass sealing aid layer, and then calcined at a temperature lower than the airtight sealing temperature of the semiconductor element, thereby removing an organic binder contained in the glass sealant. A semiconductor element is then housed within a recess of the ceramic package and the ceramic lid and a glass sealant are heated to hermetically seal the ceramic lid with the semiconductor element in the recess to the ceramic package.

REFERENCES:
patent: 4704626 (1987-11-01), Mahulikar et al.
patent: 4730203 (1988-03-01), Watanabe et al.
patent: 4761518 (1988-08-01), Butt et al.
Patent Abstracts of Japan, vol. 7, No. 129 (E-179) Jun. 4, 1983 & JP-A-58 044749 (Nippon Denki KK) Mar. 15, 1983.
Patent Abstracts of Japan, vol. 11, No. 23 (E-473) Jan. 22, 1987 & JP-A-61 194751 (Hitachi Ltd) Aug. 29, 1986.

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