Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Outside periphery of package having specified shape or...
Patent
1997-12-09
2000-07-18
Chaudhuri, Olik
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Outside periphery of package having specified shape or...
257678, 257704, 257705, 257710, 257731, H01L 2304
Patent
active
060911468
ABSTRACT:
A reworkable multi-chip module contains a large multi-chip module package (2) with an opening at the top to permit access to an internal region for semiconductor devices, the opening being at least four square inches area with the length or width dimension being at least two inches. The opening is sealed with a stiff closure (1) of sufficient rigidity to withstand at least one atmosphere of differential pressure without significant deflection, is removable in a single piece and may be reinstalled. The closure includes a panel of electrically non-conductive material (3) and a metal flange (5) borders the periphery of the panel to support the panel on the top of the module package.
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"Lid Deflection for MCM,s in Airborne Application" ICEMCM 96 Proceedings of the1996 EHM Conference on Multicip Modules, pp. 167-172, Apr. 7, 1996.
Berkely Ryan S.
Massey Mary C.
Park Steven
VanLiew Steven F.
Chambliss Alonzo
Chaudhuri Olik
Goldman Ronald M.
TRW Inc.
Yatsko Michael S.
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