Ceramic lid assembly for hermetic sealing of a semiconductor chi

Details Ceramic lid assembly for hermetic sealing of a semiconductor chi Ceramic lid assembly for hermetic sealing of a semiconductor chi

1980-02-19

1981-09-29

Hall, George T.

Receptacles

Closures

29588, 174 52S, 174 685, 174 52FP, 252514, 219 87, B65D 728, B65D 640, B65D 3900

Patent

active

042918154

ABSTRACT:
A ceramic lid assembly includes an integral heat fusible layer defining a hermetic sealing area provided around the periphery of a ceramic lid for hermetic sealing semiconductor chips in a flat pack. The integral heat fusible layer includes a metallized layer, an oxidation inhibiting layer, and a flowed solderable layer in registration with each other in the hermetic sealing area.

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patent: 4192433 (1980-03-01), Hascoe

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