Ceramic joined body

Details Ceramic joined body Ceramic joined body

1989-09-20

1992-08-11

James, Andrew J.

357 71, 357 80, H01L 2308

Patent

active

051384264

ABSTRACT:
In a ceramic joined body wherein a first metalizing layer formed on a surface of an aluminum nitride member on which semiconductor elements are installed and a second metalizing layer formed on a surface of an insulation substrate fireable at low temperatures are joined with each other via a solder used at high temperatures, an intermediate layer including a predetermined metal component and a predetermined glass component is arranged between the insulation substrate and the second metalizing layer. The glass component is melted into the insulation substrate during the firing operation, and thus a sufficient connection strength between the insulation substrate and the aluminum nitride member can be obtained. Moreover, the metal component and the glass component function to make the thermal expansion coefficient an intermediate value between the insulation substrate and the first metalizing layer, and thus heat stress generated during the brazing operation can be eliminated.

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Magdo, "Semiconductor encapsulation", IBM TDB, vol. 20, No. 10, Mar./78, pp. 3903-3904.

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