Ceramic IC package attachment apparatus

Details Ceramic IC package attachment apparatus Ceramic IC package attachment apparatus

1983-11-04

1987-06-30

Lee, John

Electrical connectors

With circuit conductors and safety grounding provision

Grounding to connector container or housing

357 80, 439 71, H01L 2302, H05K 100

Patent

active

046774580

ABSTRACT:
An integrated circuit package includes a leadless ceramic chip carrier and four connectors mounted thereto. The chip carrier has a rectangular surface with a plurality of conductive pads at its periphery. Each connecter includes a set of elongate conductive arms attached to the contact pads and extended outward therefrom and parallel to one another. The outer ends of the arms in each connector are attached to a generally flat and dielectric member. The arms are folded back upon themselves to position each member opposite the leadless chip carrier surface, with the outer ends of its associated arms aligned with the pads. So aligned, the arm ends are positioned for direct connection to selected contacts on a printed circuit board.

REFERENCES:
patent: 3114080 (1963-12-01), Koda et al.
patent: 4037270 (1977-07-01), Ahmann et al.
patent: 4461524 (1984-07-01), McGhee
patent: 4463217 (1984-07-01), Orcutt
patent: 4506938 (1985-03-01), Madden
patent: 4511201 (1985-04-01), Baker et al.
patent: 4553192 (1985-11-01), Babuka et al.
patent: 4555152 (1985-11-01), Johnson et al.

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