Ceramic hybrid integrated circuit having surface mount device so

Details Ceramic hybrid integrated circuit having surface mount device so Ceramic hybrid integrated circuit having surface mount device so

1989-01-17

1990-09-25

Thompson, Gregory D.

Electricity: electrical systems and devices

Miscellaneous

361386, 361400, H01R 900, H05K 720

Patent

active

049597515

ABSTRACT:
A printed circuit board assembly uses a conductive pattern that includes both firmly adherent conductors and controllably adherent conductors. The controllably adhering conductors are free to lift off the printed circuit board to relieve mechanical forces caused by thermal stresses at solder joints between the controllably adherent conductors and integrated circuit chips of the assembly.

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patent: 3519890 (1970-07-01), Ashby
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patent: 3808475 (1974-04-01), Buelow et al.
patent: 4026759 (1977-05-01), McBride et al.
patent: 4063993 (1977-12-01), Burns
patent: 4079511 (1978-03-01), Grabbe
patent: 4295184 (1981-10-01), Roberts
patent: 4728751 (1988-03-01), Canestaro et al.

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