Ceramic heat sink with micro-pores structure

Details Ceramic heat sink with micro-pores structure Ceramic heat sink with micro-pores structure

2005-11-22

2005-11-22

Chervinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S708000, C361S709000, C165S185000

Reexamination Certificate

active

06967844

ABSTRACT:
A ceramic heat sink having a micro-pores structure includes a thermal conductive layer mounted on a surface of a heat source to absorb heat from the heat source, a heat dissipation layer combined with the thermal conductive layer and having a micro-pores structure with hollow crystals to provide a relatively greater surface area, and a cooling fan mounted on the heat dissipation layer to provide a forced convection effect. Thus, the micro-pores structure can increase the contact surface area between the heat sink and the air, thereby enhancing the heat dissipation effect of the ceramic heat sink.

REFERENCES:
patent: 6529379 (2003-03-01), Fuller et al.
patent: 02113561 (1990-04-01), None
patent: 03036754 (1991-02-01), None

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