Ceramic-glass-metal packaging for electronic components incorpor

Details Ceramic-glass-metal packaging for electronic components incorpor Ceramic-glass-metal packaging for electronic components incorpor

1987-01-20

1988-08-02

Grimley, Arthur T.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

437217, 357 74, H01L 2308

Patent

active

047615184

ABSTRACT:
A semiconductor casing is formed of a ceramic-glass-metal composite material with a leadframe embedded in a base component. The leadframe may include holes therethrough to mechanically interlock with the composite material. Also, a process comprises forming a four-sided semiconductor casing having a leadframe with an aluminum cladding that is etched away at the ends extending from the casing.

REFERENCES:
patent: 3781457 (1973-12-01), McKerreghan
patent: 4491622 (1985-01-01), Butt
patent: 4569692 (1986-02-01), Butt

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