Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent
1991-01-16
1992-07-28
Picard, Leo P.
Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
357 74, 428620, H01L 2302
Patent
active
051342464
ABSTRACT:
A ceramic-glass integrated circuit package utilizing low temperature sealing glass and having reduced lead to lead capacitance. The inventive package includes a cap and a base. The base includes a ceramic base substrate, a first layer of conductive material adjacent the ceramic base substrate to serve as a ground plane, and a second layer of conductive material adjacent the ceramic base to serve as a power plane. A glass material is selectively deposited on the base substrate to form at least one discrete void for housing an integrated circuit chip, and a lead frame having a plurality of leads is embedded in the glass material and electrically connected to the ground and power planes but physically separated therefrom. In one embodiment, integral decoupling capacitors are further included on the base substrate. Incorporation of ground and power planes and decoupling capacitors into a ceramic-glass integrated circuit package adapts these low cost packages to high-speed applications.
REFERENCES:
patent: 4891687 (1990-01-01), Mallik et al.
patent: 4931854 (1990-06-01), Yonemasu et al.
Beppu Henry
Kusuhara Toshi
Nomura Aki
Kyocera America, Inc.
Ledynh Bot L.
Picard Leo P.
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