Ceramic-glass integrated circuit package with ground plane

Details Ceramic-glass integrated circuit package with ground plane Ceramic-glass integrated circuit package with ground plane

1990-05-07

1991-02-12

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

357 74, 29827, 428620, H05K 506

Patent

active

049926284

ABSTRACT:
A ceramic-glass integrated circuit package utilizing low temperature sealing glass and having reduced lead to lead capacitance. The inventive package includes a cap and a base. The base includes a ceramic base substrate and a layer of conductive material adjacent the ceramic base substrate to serve as a ground plane. A glass material is selectively deposited on the base substrate to form at least one discrete void for housing an integrated circuit chip, and a lead frame having a plurality of leads is embedded in the glass material and electrically connected to the ground plane but physically separated therefrom. Incorporation of a ground plane into a ceramic-glass integrated circuit package adapts these low cost packages to high-speed applications.

REFERENCES:
patent: 4891687 (1990-01-01), Mallik et al.
patent: 4931854 (1990-06-01), Yonemasu et al.

Affiliated with

Also associated with

Rating

Ceramic-glass integrated circuit package with ground plane does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Ceramic-glass integrated circuit package with ground plane, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ceramic-glass integrated circuit package with ground plane will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-21913