Ceramic frames and capsules for Z-axis modules

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Patent

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Details

361729, 361761, H05K 720

Patent

active

053195213

ABSTRACT:
The Ceramic frames and capsules for Z-axis modules shown herein are formed by placing chips 10 into a ceramic frame 12, breaking apart the frame 12 into sub-frames 26, and bonding the sub-frames 26 into a module 30. The sub-frames 26 may be separated by ceramic sub-backings 28. Each sub-frame 26 and sub-backing 28 forms a capsule 22.

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patent: 4764846 (1988-08-01), Go
patent: 4933808 (1990-06-01), Horton et al.
patent: 4959900 (1990-10-01), de Givry et al.
patent: 4982311 (1991-01-01), Dehaine et al.

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