Ceramic filled glass dielectrics

Details Ceramic filled glass dielectrics Ceramic filled glass dielectrics

1987-11-12

1988-09-20

Dixon, Jr., William R.

Compositions: ceramic

Ceramic compositions

Glass compositions, compositions containing glass other than...

501 22, 501 26, 428210, C03C 804

Patent

active

047725745

ABSTRACT:
An improved dielectric ink for the fabrication of multilayer, copper-based integrated circuits is disclosed. The subject inks comprise a suitable ceramic filler material, an organic vehicle and a lead-zinc-aluminum-borosilicate glass frit. Dielectric layers formed from the subject inks are characterized by exceptional resistance to the penetration therein by flux materials such as PbO and Bi.sub.2 O.sub.3 from conventional copper conductors during repeated firings.

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patent: 4377642 (1983-03-01), Prabhu et al.
patent: 4385127 (1983-05-01), Chyung
patent: 4400214 (1983-08-01), Ogawa et al.
patent: 4506026 (1985-03-01), Hodgkins

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