Ceramic electronic component and method for manufacturing...

Details Ceramic electronic component and method for manufacturing... Ceramic electronic component and method for manufacturing...

2005-09-08

2010-02-16

Talbot, Brian K (Department: 1792)

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

C427S097700

Reexamination Certificate

active

07662430

ABSTRACT:
The present invention relates to a ceramic electronic component wherein via conductors that are embedded in through holes of dielectric layers formed from a sintered body of ceramic particles are made by firing a electrically conductive paste for via conductor that contains inorganic particles made of the same material as the ceramic particles that constitute the dielectric layer and having an average particle diameter smaller than that of the ceramic particles, and a method for manufacturing the same. According to the present invention, such a ceramic electronic component can be provided that the via conductors and the internal electrodes are electrically connected with each other satisfactorily without voids generated therein.

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patent: 2003-123534 (2003-04-01), None
patent: 2003-229325 (2003-08-01), None

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