Ceramic electronic component and method for manufacturing...

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

Reexamination Certificate

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C029S025420

Reexamination Certificate

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07436649

ABSTRACT:
The heat resistance of a joint between a terminal electrode and a metal terminal as well as the bonding strength of the joint are increased in a ceramic electronic component. The surface of the metal terminal in contact with a binder is formed of a coating layer which is a Ag-based metal plated film. The binder contains a metal powder composed of a Cu-based metal and having an average particle diameter of 2.0 μm or less and a glass component. The step of joining the metal terminal to a terminal electrode via the binder includes bringing the terminal electrode into intimate contact with the metal terminal via the binder and heat-treating them at a temperature in the range of 550° C. to 750° C. to form a Ag—Cu alloy layer between the metal terminal and a metal bonding layer, thus joining the terminal electrode to the metal terminal by Ag—Cu alloy bonding.

REFERENCES:
patent: 4320281 (1982-03-01), Cruickshank et al.
patent: 6046902 (2000-04-01), Nakagawa et al.
patent: 6081416 (2000-06-01), Trinh et al.
patent: 6181544 (2001-01-01), Nakagawa et al.
patent: 6201683 (2001-03-01), Yamada et al.
patent: 6288887 (2001-09-01), Yoshida et al.
patent: 6388864 (2002-05-01), Nakagawa et al.
patent: 6433992 (2002-08-01), Nakagawa et al.
patent: 6515844 (2003-02-01), Moriwaki et al.
patent: 6574089 (2003-06-01), Moriwaki et al.
patent: 6704189 (2004-03-01), Yoshii et al.
patent: 6940708 (2005-09-01), Yoshii et al.
patent: 10-154633 (1998-06-01), None
patent: 2002-231564 (2002-08-01), None
patent: 2002-231565 (2002-08-01), None
patent: 2002-231569 (2002-08-01), None
patent: 2002-254195 (2002-09-01), None
patent: 3376971 (2002-12-01), None
patent: 2004-47671 (2004-02-01), None
patent: 2005-125408 (2005-05-01), None
patent: 2005-167257 (2005-06-01), None

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