Ceramic die for cutting and shaping lead frames and method of cl

Details Ceramic die for cutting and shaping lead frames and method of cl Ceramic die for cutting and shaping lead frames and method of cl

1995-02-21

1996-12-10

Larson, Lowell A.

Wireworking

Crimping

72462, B21D 3701

Patent

active

055822150

ABSTRACT:
A ceramic die for cutting and shaping lead frames, in which at least a working section thereof is made of a specific ceramic material having an iron and cobalt content of less than 100 ppm in total. The ceramic die can be formed in a complex shape with a high precision and has a prolonged lifetime because of its superior mechanical properties, such as high wear resistance and high strength, and less probability of adhesion of foreign matter such as solder or the lead frame material thereto. Even if the solder or lead frame material is adhered onto the die, the adhered matter can be removed through a simple procedure in a shortened time. The die is further improved by depositing a hard carbon film onto the surface of the working section.

REFERENCES:
patent: 5095730 (1992-03-01), Lauder

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