Ceramic composition and ceramic wiring board

Details Ceramic composition and ceramic wiring board Ceramic composition and ceramic wiring board

2007-02-13

2007-02-13

Group, Karl (Department: 1755)

Compositions: ceramic

Ceramic compositions

Refractory

C501S005000, C501S122000, C501S123000, C428S210000, C428S701000, C428S702000

Reexamination Certificate

active

10515729

ABSTRACT:
To provide a ceramic composition and a ceramic wiring board that can be formed by the firing at a low temperature of 1,000° C. or less, has high strength and is advantageous when electronic component regions utilizing a ceramic layer are formed thereon.A raw ceramic material or calcined powder thereof having a composition consisting of 100 parts by mass of a main component that consists of 52 to 62% by mass of SiO2, 12 to 22% by mass of MgO, and 21 to 32% by mass of CaO and 0.5 to 3 parts by mass of a boron component in terms of the oxide form is molded and fired to obtain a ceramic composition that contains a diopside crystal as a primary crystal. By forming a wiring layer with conductive material on a substrate made of the ceramic composition, a ceramic wiring board is obtained.

REFERENCES:
patent: 2000016837 (2000-01-01), None
patent: 20000086288 (2000-03-01), None
patent: 2000-128628 (2000-05-01), None
patent: 2001-278657 (2001-10-01), None
patent: 2001-348268 (2001-12-01), None
patent: 2001348268 (2001-12-01), None
patent: 2003-002735 (2003-01-01), None

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