Ceramic combined cover

Details Ceramic combined cover Ceramic combined cover

1986-11-21

1988-05-24

Rutledge, Dewayne L.

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

428620, 428660, 428665, 428670, 428672, 428673, 220200, 220359, 174 52FP, B32B 1504

Patent

active

047465832

ABSTRACT:
A combination ceramic sealing cover for a semiconductor package has a flat ceramic lid member with metallization applied as a foundation for a seal ring or frame portion. On the metallized layer is a gold-tin solder layer, in the form of either a solder ring that is tack welded on, or solder paste that is screened onto the base metallization and furnace reflowed.

REFERENCES:
patent: 3107756 (1963-10-01), Gallet
patent: 3340602 (1965-02-01), Hontz
patent: 4291815 (1981-09-01), Gordon et al.
patent: 4331253 (1982-05-01), Gordon et al.
patent: 4331258 (1982-05-01), Geschwind
patent: 4356047 (1982-10-01), Gordon et al.
patent: 4513062 (1985-04-01), Suzuki et al.

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