Ceramic circuit substrate and method of fabricating the same

Details Ceramic circuit substrate and method of fabricating the same Ceramic circuit substrate and method of fabricating the same

1997-09-22

2000-08-15

Jones, Deborah

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428594, 428901, 419 22, 174261, 156 8912, B32B 300, B32B 3120, B32B 3126

Patent

active

061033545

ABSTRACT:
A ceramic circuit substrate includes an insulating layer fabricated of a ceramic, a first surface conductor layer fabricated on a surface of the insulating layer and embedded in the insulating layer except at least its surface, and a second surface conductor layer fabricated to be stacked on the first surface conductor layer. A method of fabricating the ceramic circuit substrate includes the steps of printing a first surface conductor layer on a surface of a ceramic green sheet forming an insulating layer, laminating the green sheet and another green sheet on which an inner conductor layer is printed, and co-firing the green sheets, thereby fabricating the first surface conductor layer on a surface of a multilayer substrate, and printing a second surface conductor layer on the first surface conductor layer so that the second surface conductor layer is stacked on the first surface conductor layer and firing the second surface conductor layer, thereby fabricating the two stacked surface conductor layers on the surface of the multilayer substrate.

REFERENCES:
patent: 4324815 (1982-04-01), Mitani et al.
patent: 4703392 (1987-10-01), Robertson
patent: 5167913 (1992-12-01), Acocella et al.
patent: 5171642 (1992-12-01), DeHaven et al.
patent: 5250394 (1993-10-01), Wei
patent: 5468315 (1995-11-01), Okada et al.
patent: 5525402 (1996-06-01), Nakamura et al.
patent: 5731067 (1998-03-01), Asai et al.

Affiliated with

Also associated with

Rating

Ceramic circuit substrate and method of fabricating the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Ceramic circuit substrate and method of fabricating the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ceramic circuit substrate and method of fabricating the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2004384