Stock material or miscellaneous articles – All metal or with adjacent metals – Component of composite having metal continuous phase...
Patent
1997-08-22
2000-03-07
Jones, Deborah
Stock material or miscellaneous articles
All metal or with adjacent metals
Component of composite having metal continuous phase...
428210, 428615, 428627, 257706, 257753, 228121, 22818021, B22F 300, H01L 2310
Patent
active
060337877
ABSTRACT:
A ceramic circuit board with a heat sink which has a long life under heat cycles. First and second aluminum plates are laminated and bonded onto both sides of a ceramic substrate through Al--Si-based brazing solders, respectively. A heat sink formed of an AlSiC-based composite material is laminated and bonded onto a surface of the first aluminum plate. The ceramic substrate is formed of AlN, Si.sub.3 N.sub.4 or Al.sub.2 O.sub.3. An Al alloy in the heat sink has an Al purity of 80-99% by weight, and the first or second aluminum plate has an Al purity not less than 99.98% by weight. The heat sink is laminated and bonded onto the first aluminum plate through the Al alloy in the heat sink.
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Alcoa's Al-SiC Cermets for Microelectronic Packaging Catalog, Aluminum Company of America Alcoa Center, PA.
Hatsushika Masafumi
Kanda Yoshio
Kuromitsu Yoshirou
Nagase Toshiyuki
Otsuki Masato
Jones Deborah
Lam Cathy F.
Mitsubishi Materials Corporation
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