Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond
Patent
1994-02-10
1997-04-22
Dixon, Merrick
Stock material or miscellaneous articles
Structurally defined web or sheet
Discontinuous or differential coating, impregnation or bond
428901, 174137A, 174137R, 3613213, 3613215, 361765, 361777, 501 15, 501153, B32B 300
Patent
active
056227698
ABSTRACT:
According to this invention, there is disclosed a thermal conductivity substrate which includes an aluminum nitride sintered body and a coating layer formed on the body of aluminum phosphate and having a surface roughness of 1 .mu.m or less, and which has excellent humidity resistance and chemical resistance.
REFERENCES:
patent: 4649125 (1987-03-01), Takeuchi et al.
patent: 4766010 (1988-08-01), Takeuchi et al.
patent: 4817304 (1989-04-01), Takeuchi et al.
patent: 4865877 (1989-09-01), Yamaguchi et al.
patent: 5214991 (1993-06-01), Shimizu et al.
patent: 5326623 (1994-07-01), Yamakawa et al.
Endo Hiroshi
Hayashi Masaru
Iwase Nobuo
Iyogi Kiyoshi
Koiwa Kaoru
Dixon Merrick
Kabushiki Kaisha Toshiba
LandOfFree
Ceramic circuit board having a thermal conductivity substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Ceramic circuit board having a thermal conductivity substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ceramic circuit board having a thermal conductivity substrate will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-340282