Ceramic circuit board having a thermal conductivity substrate

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond

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Details

428901, 174137A, 174137R, 3613213, 3613215, 361765, 361777, 501 15, 501153, B32B 300

Patent

active

056227698

ABSTRACT:
According to this invention, there is disclosed a thermal conductivity substrate which includes an aluminum nitride sintered body and a coating layer formed on the body of aluminum phosphate and having a surface roughness of 1 .mu.m or less, and which has excellent humidity resistance and chemical resistance.

REFERENCES:
patent: 4649125 (1987-03-01), Takeuchi et al.
patent: 4766010 (1988-08-01), Takeuchi et al.
patent: 4817304 (1989-04-01), Takeuchi et al.
patent: 4865877 (1989-09-01), Yamaguchi et al.
patent: 5214991 (1993-06-01), Shimizu et al.
patent: 5326623 (1994-07-01), Yamakawa et al.

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