Ceramic circuit board and method for manufacturing the same

Details Ceramic circuit board and method for manufacturing the same Ceramic circuit board and method for manufacturing the same

2007-10-23

2007-10-23

Norris, Jeremy C (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S255000, C174S258000

Reexamination Certificate

active

10774551

ABSTRACT:
In the ceramic circuit board, within the through hole of the ceramic substrate is arranged the metal column which is 0 to 150 μm shorter relative to the thickness of the ceramic substrate; the metal circuit plates are attached to both surfaces of the ceramic substrate to stop up the through hole; and the metal column and the metal circuit plate are bonded together via the brazing material. For its manufacture, the metal column with brazing material is used that is made 40 to 140 μm longer relative to the thickness of the ceramic substrate by being formed of the metal column which is 0 to 150 μm shorter relative to the thickness of the ceramic substrate and has its both ends coated with the brazing material.

REFERENCES:
patent: 3077511 (1963-02-01), Bohrer et al.
patent: 4131516 (1978-12-01), Bakos et al.
patent: 4816323 (1989-03-01), Inoue
patent: 4925024 (1990-05-01), Ellenberger et al.
patent: 5229549 (1993-07-01), Yamakawa et al.
patent: EP588651 (1994-03-01), None
patent: 6-13726 (1994-01-01), None
patent: 06-120634 (1994-04-01), None
patent: 406120634 (1994-04-01), None
patent: 406120635 (1994-04-01), None
patent: 10-125824 (1998-05-01), None
patent: 11-340600 (1999-12-01), None
patent: 2001-068808 (2001-03-01), None

Affiliated with

Also associated with

Rating

Ceramic circuit board and method for manufacturing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Ceramic circuit board and method for manufacturing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ceramic circuit board and method for manufacturing the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3901673